Tejas Networks unveils hyper-scalable DCI platform TJ1600-D3 at MWC 2026 to power next-generation data center connectivity!
Tejas Networks has introduced its next-generation Data Center Interconnect (DCI) platform, the TJ1600-D3, at Mobile World Congress 2026 in Barcelona. The new platform was unveiled by Jyotiraditya Scindia, highlighting India’s growing capabilities in advanced telecom and networking technologies.
The TJ1600-D3 is a high-performance WDM (Wavelength Division Multiplexing) optical transport platform designed to meet the rapidly rising demand for high-capacity data center connectivity. With the global expansion of artificial intelligence workloads, hyperscale cloud infrastructure and distributed computing environments, data centers require faster, more efficient and highly scalable interconnect solutions capable of transmitting enormous volumes of data with minimal latency.
Speaking at the launch, Jyotiraditya Scindia congratulated Tejas Networks on achieving another milestone in telecom innovation. He noted that the development reflects the increasing strength of India’s research and development ecosystem in next-generation communications technologies. According to him, the launch also demonstrates India’s growing presence in the global telecommunications and digital infrastructure landscape.
Modern digital infrastructure is evolving rapidly as technology companies expand hyperscale data centers, AI compute clusters and edge computing networks. These developments are creating new network traffic patterns that require powerful optical transport systems capable of handling massive bandwidth requirements while maintaining reliability and energy efficiency.
The TJ1600-D3 platform has been specifically designed to address these challenges. Powered by advanced digital signal processors and next-generation chipsets, the platform supports flexible line rates ranging from 400 gigabits per second to 1.2 terabits per second per wavelength. This flexibility allows network operators and cloud providers to scale their data center networks according to growing bandwidth demands.
One of the platform’s key capabilities is its ability to deliver up to 51.2 terabits per second of total shelf capacity. This level of performance enables telecom operators, hyperscale cloud companies and large enterprises to build future-ready data center networks capable of supporting large-scale AI processing, cloud services and high-performance computing workloads.
The system has also been designed to offer operational flexibility and energy efficiency. Customers can choose between performance-optimized and power-optimized traffic sled configurations depending on their specific deployment requirements. This approach allows network operators to balance performance, power consumption and operational efficiency based on the needs of different applications.
The platform is built in a compact 3-RU form factor, making it suitable for high-density deployments in modern data centers. It includes redundant controllers, cooling fans and power modules to ensure high availability and reliability. In addition, the system supports universal AC and DC power compatibility, enabling flexible deployment across different network environments.
Arnob Roy, Chief Operating Officer and Executive Director of Tejas Networks, said the new platform is designed to address the growing need for high-capacity, scalable connectivity infrastructure. He emphasized that telecom operators and cloud service providers are increasingly seeking systems that combine performance, resilience and energy efficiency to support distributed computing and AI-driven digital services.
With the introduction of the TJ1600-D3 platform, Tejas Networks aims to strengthen its role in the global optical networking market while contributing to the development of next-generation digital infrastructure required to power AI, cloud computing and high-speed data center connectivity.
