SVS-Vistek’s Senswir FXO Cameras Advance Semiconductor Inspection with Extended Wavelength Imaging!

SVS-Vistek GmbH is pushing the boundaries of semiconductor inspection with the launch of its Senswir FXO industrial camera series, engineered to deliver exceptional precision in detecting both visible and subsurface defects. Semiconductor fabrication demands extremely high accuracy, reliability and speed, and the Senswir FXO cameras address these requirements through a combination of expanded wavelength capability, high-resolution sensor technology and advanced thermal management. This new camera platform is designed to help chip manufacturers improve yield, reduce inspection complexity and enhance the quality of their optical analysis systems.

One of the most significant innovations in the Senswir FXO series is its extended wavelength range of 400–1,700 nm, enabling the cameras to simultaneously capture Short-Wave Infrared (SWIR) and visible-light images. This hybrid imaging capability eliminates the need for dual-camera setups, simplifying system design and reducing both cost and space requirements. By integrating SWIR and visible imaging into a single platform, SVS-Vistek provides manufacturers with a powerful tool to identify surface defects, material inconsistencies and buried features that are not detectable with standard optical solutions. This makes the Senswir FXO series particularly valuable in semiconductor inspection, where subsurface analysis is essential for quality assurance.

The Senswir FXO lineup includes two models designed to support different inspection needs and performance levels. The Senswir FXO 992 offers a resolution of 5.2 megapixels at 132 frames per second, while the Senswir FXO 993 delivers 3.1 megapixels at 173 frames per second. Both cameras use 3.45 µm pixel sensors, which allow for excellent detail capture when combined with standard C-Mount lenses. This pixel size strikes an ideal balance between sensitivity, precision and compatibility, enabling engineers to design inspection systems capable of identifying microscopic semiconductor defects at high throughput rates.

To support high-speed data acquisition, the Senswir FXO cameras are available with 10GigE Vision or CoaXPress CXP-12 interfaces. These high-bandwidth communication standards ensure rapid transfer of imaging data to processing units, maintaining the performance required for modern semiconductor production lines. The inclusion of Two-Point Non-Uniformity Correction (NUC) further enhances image consistency and clarity by compensating for sensor-specific variances, which is vital for automated defect detection algorithms that rely on stable and accurate image data.

Thermal stability is another defining strength of the Senswir FXO series. Efficient thermal management in the camera housing ensures that performance remains consistent even during long inspection cycles. For applications requiring extremely low noise and high sensitivity, SVS-Vistek offers an optional Thermoelectric Cooling (TEC) system based on the Peltier effect. TEC actively cools the sensor, reducing dark current and thermal noise to produce cleaner, more reliable images—an advantage in environments where small inconsistencies can lead to major production challenges.

Integration and system design flexibility are further enhanced through GenICam 3.0 and GenTL support, providing a standardized interface for seamless software compatibility. Engineers also gain the advantage of an integrated four-channel strobe controller, which enables controlled and synchronized illumination setups for complex inspection tasks.

By combining extended wavelength imaging, high-speed performance, advanced noise control and seamless integration, SVS-Vistek’s Senswir FXO cameras offer semiconductor manufacturers a robust solution for next-generation inspection demands. This technology strengthens quality control, accelerates production workflows and supports the increasing complexity of modern semiconductor devices.