Ansys announced that it has joined TSMC’s OIP Cloud Alliance to help mutual clients develop fully distributed workflows. Customers will be able to reap the full benefits of faster run times and elastic computing with major cloud suppliers by advancing Ansys multiphysics solutions towards cloud interoperability with TSMC’s technological enablement.

TSMC and its OIP Cloud Alliance partners are developing next-generation, cloud-optimized design approaches that combine EDA parallelism and cloud scalability to further accelerate turnaround time of important design processes. To effectively utilise the cloud, Ansys and other EDA partners will optimise their tools for multi-threaded, fully-distributed runs, while cloud partners will introduce new virtual machines best suited for the EDA burden of IC designs.

“Our customers of all sizes are leveraging the cloud to boost productivity while designing in TSMC’s leading-edge technologies for new applications ranging from high-performance computing to mobile, artificial intelligence, networking, and 3D-IC,” said Dan Kochpatcharin, head of TSMC’s Design Infrastructure Management Division. “By welcoming Ansys as the newest member of our OIP Cloud Alliance, TSMC hopes to make Ansys’ leading multiphysics signoff solutions available to all of our customers and assist them in bringing differentiated products to market faster and with higher quality.”