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Raytheon, a subsidiary of RTX, has secured a three-year contract with DARPA to develop ultra-wide bandgap semiconductors (UWBGS) utilizing cutting-edge diamond and aluminum nitride technologies. This innovative work is expected to significantly enhance electronic warfare capabilities, particularly in the circuitry of hypersonic weapons.
The contract is structured in two phases. In the first phase, the Raytheon Advanced Technology team will focus on creating semiconductor films made from diamond and aluminum nitride and integrating them into electronic devices. The second phase will aim to optimize and mature these technologies on larger-diameter wafers specifically for sensor applications.
Raytheon’s expertise in developing advanced materials for Department of Defense systems, such as Gallium Arsenide and Gallium Nitride, positions them well for this initiative. The unique properties of UWBGS present several advantages over traditional semiconductor technologies, enabling the development of compact, high-power radio frequency switches, limiters, and amplifiers. Their exceptional thermal conductivity allows these devices to operate at higher temperatures and in more extreme conditions, making them suitable for a variety of applications.
The primary objective of this initiative is to enhance existing radar and communication systems while extending their capabilities and range. This includes advancements in cooperative sensing, electronic warfare, directed energy applications, and high-speed weapon systems, notably hypersonics.
Raytheon’s foundry in Andover, Massachusetts, will be the site for this groundbreaking work. As the U.S. has been actively pursuing hypersonic weapon development since the early 2000s, this project aligns with ongoing efforts to bolster the country’s defense capabilities. Additionally, the U.S. Missile Defense Agency recently selected Northrop Grumman to create a novel defensive countermeasure against hypersonic missile threats, emphasizing the importance of staying ahead in this rapidly evolving technological landscape.
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