OMRON Automation Launches High-Speed X-ray Inspection for Power Semiconductors at Productronica India 2024!

OMRON Automation has introduced a game-changing inspection solution, the 3DCT AXI X850, at Productronica India 2024, showcasing its expertise in Surface Mount Technology (SMT) and Through-hole Inspection. The new system, designed for the power semiconductor industry, utilizes advanced X-ray technology to detect defects like voids, insufficient solder, and misalignments, ensuring enhanced reliability and product consistency.

Sameer Gandhi, Managing Director of OMRON Automation India, emphasized the importance of this solution in the evolving electric vehicle (EV) market, where semiconductors play a critical role in powering essential systems. As demand grows for faster charging and miniaturization, the 3DCT AXI X850 ensures precise inspection for multi-layer semiconductor products, supporting various applications in EVs and beyond.

OMRON also highlighted its Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) systems, offering cutting-edge inspection technologies for industries such as automotive and networking equipment, where quality control is crucial. With advanced 3D imaging and high-speed capabilities, OMRON’s solutions streamline manufacturing processes, ensuring safety and efficiency.

OMRON’s full range of inspection technologies aims to drive operational excellence, positioning the company as a leader in automation solutions for India’s rapidly growing semiconductor, automotive, and digital technology sectors.